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Your search returned 14 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2001 Volume number : 24 Issue: 01 |
Thermal Kcycling Aging Effects On Microstructural And Mechanical Properties Of A Single Pbga Solder Joint Specimen
(Article)
Subject:
Eutectic Solidification
,
Microstructure
,
Solder-Joint Inspection
,
Thermal Cycle Stability
Author:
John H. L.
Pang
Kwang Hong
Tan
Z
Wang
page:
10
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15
Nonuniform Temperature Distribution In Electronic Devices Cooled By Flow In Parallel Microchannels
(Article)
Subject:
Flow Patterns
,
Hydrodynamic Instability
,
Parallel Mechanism
Author:
G
Hetsroni
A
Mosyak
Zelik
Segal
page:
16
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23
Parametric Optimization Of Multichanneled Heat Sinks For Vlsi Chip Cooling
(Article)
Subject:
Cooling
,
Forced Convection
,
Heat Sink
,
Microchannel
Author:
Yoichi
Murakami
Bora B.
Mikic
page:
2
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9
Effect Of Nonconduction Filler Additions On Aca Properties And The Reliability Of Aca Flip Chip On Organic Substrates
(Article)
Subject:
Reliability
,
Flip-Chip
,
Coefficient Of Thermal Expansion (Cte)
Author:
Myung-Jin
Yim
Kyung-Wook
Paik
page:
24
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32
A Voltage Controlled Tunable Thin Film Distributed Rc Notch Filter
(Article)
Subject:
Thin Film
,
Rc Notch Filrer
,
Y-Doping
Author:
Wonyoung
Choi
Susan
Trolier-Mckinstry
page:
33
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37
Study On Effect Of Coupling Agents On Underfill Material In Flip Chip Packaging
(Article)
Subject:
Adhesion
,
Coupling
,
Silane
Author:
Shijian
Luo
C. P.
Wong
page:
38
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42
Effect Of Uv/Ozone Treatment On Surface Tension And Adhesion In Electronic Pakaging
(Article)
Subject:
Adhesion
,
Alumina
,
Underfill
Author:
Shijian
Luo
C. P.
Wong
page:
43
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49
Contact Resistance Calculations Generalization Of Greenwood'S Formula Including Interface Films
(Article)
Subject:
Analytical Formulation
,
Calculations
,
Contact Resistance
,
Finite Element Analysis
Author:
Lionel
Boyer
page:
50
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58
Development Of No-Flow Underfill Materials For Lead-Free Solder Bumped Flip-Chip Applications
(Article)
Subject:
Epoxy Resin
,
Flip Chip
,
Lead-Free Solder
,
Microelectronics
Author:
Z
Zhang
S. H.
Shi
C. P.
Wong
page:
59
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66
Polymer Thick Films On Silicon A Route To Hybrid Midcrosystems
(Article)
Subject:
Hybrid
,
Microsystems
,
Silicon
,
Thick Film
Author:
Thomas V.
Papakostas
Neil M.
White
page:
67
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75
Mapping Of Mechanical, Thermomechanical And Wire-Bond Strain Fields In Packaged Si Integrated Circuits Using Synchrotron White Beam X-Ray Topography
(Article)
Subject:
High Resolution
,
Nondestructive Evaluation
,
Package Modeling
Author:
Patrick J.
Mcnally
A. N.
Danilewsky
John W.
Curledy
page:
76
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83
Investigation Of The Underfill Delamination And Cracking In Filp Chip Modules Under Temperature Cyclic Loading
(Article)
Subject:
Cracking
,
Delamination
,
Finite - Element Analysis
,
Underfill
Author:
X-J.
Fan
T. B.
Lim
page:
84
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91
Bonding Stress And Reliability Of High Power Gaas-Based Lasers
(Article)
Subject:
Bonding Strength
,
Conductive Contrete
,
Photoluminescence
Author:
Dubravka
Lisak
page:
92
-
98
Design Of Accelerated Corrosion Tests For Electronic Components In Automotive Applications
(Article)
Subject:
Accelerated Corrosion Test
,
Environmental
,
Service Life
Author:
Peter
Eriksson
Bo
Carlsson
Inger Odnevall
Wallinder
page:
99
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107
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